0×10(-11) and P=2.9×10(-9), respectively). In addition, genome-wide associations (P<5×10(-8))

were identified and replicated for baseline Lp-PLA(2) mass at CETP and for Lp-PLA(2) activity at the APOC1-APOE and PLA2G7 loci. Among 2673 statin-allocated participants, both Lp-PLA(2) mass and activity were reduced by >30% and low-density lipoprotein cholesterol by 50% after 12 months of statin therapy (P<0.001 for both). Variants in ABCG2 and LPA were associated with change in statin-induced Lp-PLA(2) activity at genome-wide significance but were substantially attenuated after adjustment for statin-induced changes in lipid levels.

Conclusions-Genome-wide NU7441 DNA Damage inhibitor significant associations at MS4A4E and TMEM49 may reflect novel influences on circulating levels of Lp-PLA(2) activity. In addition, genome-wide significant associations with rosuvastatin-induced change in Lp-PLA(2) activity were observed in ABCG2 and LPA, likely because of their impact on statin-induced Selinexor low-density lipoprotein cholesterol lowering. (Circ Cardiovasc Genet. 2012;5:676-685.)”
“Silicon light emitting diode arrays made by industrial planar technology and operating at T>300 K in the double

injection mode have been shown to be an efficient emitters of the infrared (IR) radiation in the 3-12 mu m spectral band. We show that due to free carrier injection in an optically thin base, which makes its emissivity to increase at the wavelengths of the free carrier absorption, the devices have thermal emission output power of 2-3 mW and local power density up to 1 mW/mm(2) at T=473 K. The 0.5-mm-thick 6×6 mm(2) emitting pixel of an array demonstrates the power conversion efficiency of 13%, a time response of 300 mu s, and an apparent temperature of the IR radiation of 400 K, which make the device BAY 73-4506 practical for use in IR dynamic scene simulation techniques.”
“A series of epoxy resin composites containing different contents of alkoxysilane functionalized polycaprolactone/polydimethylsiloxane (PCS-2Si) were prepared after curing with

polyamidoamine curing agent at different temperatures. The effects of PCS-2Si content and curing temperature on morphologies, solvent resistance, and surface properties of the composites were studied. The scanning electron microscope results showed that increasing the PCS-2Si content and Curing temperature caused the changes of miscibility between epoxy and modifier, leading to different morphologies. Other data from solvent swelling and surface tension of composites cured at the same temperature illustrated that the modified epoxy resins with higher content of PCS-2Si had less crosslinked networks, but lower surface tension. At the same time, the composites cured at higher curing temperature generally had more resistance to chemicals and higher surface tension due to the formation of highly crosslinked networks. (C) 2009 Wiley Periodicals, Inc.